主要用于集成电路、功率器件、MEMS、VCSEL等半导体器件的生产制造，主要功能在晶圆上进行扩散、氧化、退火等工艺，实现杂质的精确掺杂，构建晶体管、电阻、电容等元件，如制造 28nm及以上节点的集成电路。

       It is mainly used in the production and manufacturing of semiconductor devices such as integrated circuits, power devices, MEMS, and VCSEL. Its main functions include performing processes such as diffusion, oxidation, and annealing on wafers to achieve precise doping of impurities and construct components such as transistors, resistors, and capacitors. For example, it is used in the manufacturing of integrated circuits with 28nm and above nodes.

核心技术优势：Core technological advantages

◆ 自动化程度高：相比卧式扩散炉更易实现自动化操作，能与天车（OHT）自动化系统配合，通过机械手等装置实现晶圆的自动上下料和传输，提高生产效率，减少人工操作带来的误差和污染。

◆ High degree of automation: It is easier to achieve automated operation compared to horizontal diffusion furnaces. It can cooperate with the Overhead Hoist Transport (OHT) automation system, and realize the automatic loading and unloading and transportation of wafers through devices such as manipulators. This improves production efficiency and reduces errors and contamination caused by manual operation.

◆ 颗粒控制好：石英舟垂直于水平面，可减少颗粒沾污，相比水平扩散炉，在工艺过程中，更有利于保持炉内环境的洁净度，降低颗粒对晶圆的污染，提高产品良率。

◆ Good particle control: The quartz boat is perpendicular to the horizontal plane, which can reduce particle contamination. Compared with horizontal diffusion furnaces, during the process, it is more conducive to maintaining the cleanliness of the furnace environment, reducing the contamination of particles on the wafers, and improving the product yield.

◆ 温度控制精准：具有高精度的温度场控制技术，能够更好地控制温度均匀性，确保晶圆上各点的工艺参数一致性，有利于提高工艺的重复性和产品质量。

◆ Precise temperature control: It has high-precision temperature field control technology, which can better control the temperature uniformity, ensure the consistency of process parameters at each point on the wafer, and is beneficial to improving the repeatability of the process and product quality.

◆ 操作安全性高：结构设计使得操作人员在上下料和维护过程中，接触高温部件和危险气体的风险相对较低，提高了操作的安全性。

◆ High operation safety: The structural design makes the risk of operators coming into contact with high-temperature components and hazardous gases relatively low during the loading and unloading and maintenance processes, improving the safety of operation.

主要参数:

◆ 工艺尺寸：适用于 8 英寸晶圆。

◆ 工作温度：通常在 200℃-1300℃。

◆ 恒温区长度：一般有 450mm、600mm、800mm、1100mm 等多种规格。

◆ 恒温区精度：高于±0.5℃

◆ 单点温度稳定性：在 600℃-1300℃范围内，可达到 ±0.5℃/24h。

Main Parameters

◆ Process size: Suitable for 8-inch wafers.

◆ Operating temperature: Usually between 200℃and 1300℃.

◆ Length of the constant temperature zone: Generally, there are various specifications such as 450mm, 600mm, 800mm, and 1100mm.

◆ Accuracy of the constant temperature zone: Higher than ±0.5℃.

◆ Single-point temperature stability: Within the range of 600℃ to 1300℃, it can reach ±0.5℃/24h.