用于掺杂（如硼、磷扩散）、氧化、退火等工艺，采用先进的控制算法和精密的硬件设备，能够实现对杂质扩散深度、浓度分布的高精度控制。相比传统扩散方法，其扩散精度更高，可重复性更好，从而提高产品的良品率和性能一致性。

       软着陆扩散系统通过末端减速控制+高精度定位，显著降低晶片在高温工艺中的机械损伤风险，尤其适用于高价值晶圆和脆性材料的制造场景，能够提升整体生产良率并减少物料损耗。

       It is used in processes such as doping (e.g., boron and phosphorus diffusion), oxidation, and annealing. By adopting advanced control algorithms and precise hardware equipment, it can achieve high - precision control of the impurity diffusion depth and concentration distribution. Compared with traditional diffusion methods, it offers higher diffusion accuracy and better repeatability, thereby improving the product yield and performance consistency.

       The soft - landing diffusion system utilizes end - deceleration control and high - precision positioning, which significantly reduces the risk of mechanical damage to wafers during high - temperature processes. It is particularly suitable for the manufacturing scenarios of high - value wafers and brittle materials, capable of enhancing the overall production yield and reducing material losses.

核心技术优势：Core technological advantages

全自动化控制：Full Automation Control

◆ 集成了 SECS/GEM 标准通信接口，可无缝对接工厂自动化系统，实现设备状态实时监控、远程参数调控以及生产数据的高效交互，为智能制造提供坚实保障。

◆ SECS/GEM Integration: Equipped with a standard SECS/GEM communication interface, it can seamlessly connect to the factory automation system, enabling real - time monitoring of equipment status, remote parameter adjustment, and efficient exchange of production data, thus providing a solid foundation for intelligent manufacturing.

高精度控制：High-precision control

◆ 推拉舟速度范围20-1000 mm/min，速度控制精度达±0.5mm/min，适配不同工艺的进料节奏需求。

◆ The speed range of the boat pushing/pulling mechanism is 20 - 1000 mm/min, and the speed control accuracy reaches ±0.5 mm/min, which can meet the feeding rhythm requirements of different processes.

兼容性与稳定性：Compatibility and stability

◆ 支持4-8英寸硅片兼容传输。

◆ It supports the compatible transfer of 4 - 8 inch silicon wafers and is adaptable to various types of boats (such as quartz boats and silicon carbide boats).

◆ 采用伺服电机，长期运行位置重复精度≤±0.5 mm。

◆ It uses a servo motor + encoder feedback system, and the long - term running position repeatability accuracy is ≤ ±0.5 mm.

智能化联动：Intelligent linkage

◆ 与炉管温度、气体流量控制系统实时联动，确保工艺过程同步性。

◆ It is in real - time linkage with the furnace tube temperature and gas flow control systems to ensure the synchrony of the process.

◆ 具备异常振动监测功能，自动触发停机保护。

◆ It has a function of abnormal vibration monitoring, which can automatically trigger the shutdown protection.

高精度温控：High - Precision Temperature Control

◆ 控温精度：±0.5，单点温度稳定性±0.5℃/24小时

◆ Temperature Control Accuracy: The temperature control accuracy reaches ±0.5°C, and the single-point temperature stability is ±0.5°C/24 hours.

◆ 支持串级控制和恒温区自动调整。

◆ Control Modes: Supports cascade control and automatic adjustment of the constant - temperature zone.

主要参数： Main Parameters

◆ 适用硅片尺寸：4-8英寸（兼容性设计）

◆ 工作温度范围：600~1300℃（最高可控升温至1300℃）

◆ 控温精度：±0.5℃

◆ 恒温区长度：300-1500m

◆ 气体控MFC精度：±0.5% F.S，气路具备缓启动功能

Main Parameters

◆ Applicable Wafer Size: 4-8 inches (with compatibility design).

◆ Operating Temperature Range: 600-1300℃ (maximum controllable temperature rise up to 1300℃).

◆ Temperature Control Accuracy: ±0.5℃.

◆ Constant - temperature Zone Length: 300-1500mm.

◆ MFC Gas Control Accuracy: ±0.5% F.S, and the gas path has a slow - start function.