无氧烘箱，半导体的无尘烘干等工艺。设备运行时，腔室内设定含量， 系统根据腔室内的含氧量自动开启N2，将腔室内的含氧量控制在设定范围内，防止材料在烘烤时被氧化。

       Oxygen-free ovens are used in processes such as dust - free drying of semiconductors. During the operation of the equipment, the oxygen content in the chamber is set. The system automatically activates the supply of N2 according to the oxygen content in the chamber, controlling the oxygen content within the set range. This prevents the materials from being oxidized during the baking process.

主要技术指标Key parameters

◆ 温度范围：RT+25~500℃

◆ 最大温度：500℃

◆ 工作温度:450℃ 工作时长30H

◆ 显示精度：±0.1℃

◆ 氧含量：<5 ppm (排氧时间<60min)

◆ 降温方式：采用水冷，最大降温速率2℃/min;

◆ Temperature range: RT+25 to 500℃

◆ Maximum temperature: 500℃

◆ Operating temperature: 450℃, operating duration: 30 hours

◆ Display accuracy:±0.1℃

◆ Oxygen content: <5ppm (oxygen evacuation time < 60 minutes)

◆ Cooling method: Water-cooled, with a maximum cooling rate of 2℃/min